Rosin Fluxes  

MCE # 185 Rosin Fluxes are formulated specially with highly pure rosin blended with excellent solvent systems to provide fine wetting properties. RA type rosin type foam flux meets all specifications like that of ISS,BSS,DIN and U.S Specification. MCE # 185 Rosin Flux has found to be effective in the military and consumer electronics industry applications both for hand and automated soldering SMD and plated -through hole.

No-Clean Fluxes

MCE # 007 Series No-Clean Fluxes are formulated specially of low solids with good foaming characteristics. It is developed to use in SMD’s and mixed technology soldering. This specially formulated flux will act as an agent to reduce the icicles and bridging with little or no residue remaining after soldering.  

Advanced No-Clean Fluxes: 

MCE # 007 No-Clean Low Residue Flux is formulated as an environment friendly, halide free low residue flux for wave soldering of through hole, mixed technology and surface mount assemblies. This specially formulated flux significantly reduces solder bridging, icicling, solder barring, with the unique blend of chemicals compounds present in the flux. High degree of ionic cleanliness and high degree of surface insulation resistance can be achieved, if the small amount of residue is removed by rinsing in any of cleaning solvents offered by Metal Connect. 

MCE Thinners: 

The continued exposure to air and working environment, solvents and other volatile chemical additives may deplete thus changing the physical and chemical properties of the flux. This may adversely affect surface tension, chemical activity, wettability and the overall performance of the flux.  

MCE proprietary Thinners helps to maintain the flux specific gravity during its operational process by its individual Flux Thinners.